Single-sided aluminum-copper composite communication substrate
Product Overview:
Main product specifications: Thickness: 2.0–3.0 mm, maximum width: 1000 mm.
Keywords:
Single-sided aluminum-copper composite communication substrate
Details
Communication substrates are primarily used in communication RF devices and RF structural components employed in 3G, 4G, and the upcoming 5G network base stations. Currently, the most commonly used substrate technology is aluminum-copper plating. However, the aluminum-copper plating process severely pollutes the environment, and the thickness of the copper plating layer often fails to fully meet the requirements of RF devices. Using our specialized equipment, we can provide customers with substrate materials composed of copper combined with various aluminum alloys. The copper layer features a rolled microstructure, and its thickness is several times greater than that of conventionally electroplated copper layers. As a result, subsequent manufacturing and processing by our customers fully comply with national environmental protection standards. Our products boast stable quality, high production efficiency, and an excellent cost-performance ratio.
Main product specifications: Thickness: 2.0–3.0 mm, maximum width: 1000 mm.
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Luoyang Tongxin Composite Materials Technology Co., Ltd.
Room 2406-2407, Building 10, Dongfang Jindian, Binhe South Road, Luoyang City, Henan Province
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