LED aluminum-copper composite heat sink substrate
Product Overview:
Product dimensions: Thickness: 0.3–2.0 mm, width: 600–1000 mm.
Keywords:
LED aluminum-copper composite heat sink substrate
Details
Product dimensions: Thickness: 0.3–2.0 mm, width: 600–1000 mm.
Grade: CA13, Condition H18/H24.
Product Features: This copper-aluminum composite strip, manufactured using multiple proprietary technologies, boasts a flat surface, high mechanical strength, and metallurgical bonding between copper and aluminum. It exhibits no delamination under rapid cooling or heating conditions and features low overall thermal resistance. When used in the LED lighting industry, the LED chips are directly mounted onto the copper surface. The heat generated by the chips is efficiently conducted away by the copper and then dissipated through the aluminum, fully leveraging copper’s excellent thermal conductivity and aluminum’s superior heat dissipation performance.
Technical parameters: Composite rate: 100%. Tensile strength: 130–220 MPa; elongation: 10–20%; copper layer thickness ratio: 10–20%.
Application field: Conductive industry: LED packaging heat-sink substrates.
Related products
Application areas
Heat exchanger
Automobiles and Power Batteries
Lighting (LED)
Architectural decoration
Household appliances (IH heating)
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Luoyang Tongxin Composite Materials Technology Co., Ltd.
Room 2406-2407, Building 10, Dongfang Jindian, Binhe South Road, Luoyang City, Henan Province
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