Aluminum-copper composite busbar
Aluminum-copper composite busbar
Aluminum-copper composite busbar
Aluminum-copper composite busbar
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  • Aluminum-copper composite busbar
  • Aluminum-copper composite busbar
  • Aluminum-copper composite busbar
  • Aluminum-copper composite busbar

Aluminum-copper composite busbar

Product Overview:

Product dimensions: Thickness 3.0–15.0 mm, width ≤ 500 mm.



Keywords:

Aluminum-copper composite busbar

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Details


  Product dimensions: Thickness 3.0–15.0 mm, width ≤ 500 mm.

  Product Features: The aluminum-copper composite busbar, manufactured using multiple proprietary technologies of our company, effectively addresses two major challenges in copper-aluminum composites: the tendency of copper and aluminum to oxidize easily, with oxide films that are difficult to remove, and the formation of intermetallic compounds (Al2Cu) at relatively low temperatures between copper and aluminum. According to SEM analysis, the thickness of the transition layer between copper and aluminum in conventional copper-clad aluminum busbars typically ranges from 15 to 50 μm; in contrast, the transition layer in our aluminum-copper composite busbar measures only 1 to 2 μm—significantly thinner than that of traditional copper-clad aluminum busbars. This ultra-thin transition layer not only achieves metallurgical bonding between copper and aluminum but also ensures excellent bonding strength, effectively resolving the issue of high resistivity in the transition layer. The composite busbar boasts outstanding overall performance: its bending, drilling, and deep-drawing capabilities are comparable to those of pure copper, while its density is lower. As a result, using this product can reduce costs by more than 30%.

  Technical Specifications: Composite strength ≥ 12 N/mm; composite ratio: 100%. Shear strength ≥ 35 MPa; tensile strength: 90–150 MPa; elongation: 0–35%; DC resistivity ≤ 0.0245 Ω·mm²/m. Surface conductivity ≥ 98%. Rated current temperature rise ≤ 65℃.

  Application fields: Conductive industry (widely applicable to high- and low-voltage switchgear, complete switchgear assemblies, busbar trunking systems, electrolytic cells, and more).

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